| 1 | Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages显示文摘A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to describe the viscoplasticity of the CBGA solder.The average viscoplastic strain energy density increment △Wave of the CBGA packages is obtained using a finite element simulation,and the influence of different structural parameters on theWave is analyzed.A simplified analytical model of the △Wave is established using the simulation data.The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test.The Darveaux lifetime predictionmodel ismodified based on the thermal fatigue lifetime obtained fromthe experiment and the corresponding △Wave.A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages.This proposed model can be used in engineering to evaluate the lifetime of CBGA packages. | Borui Yang Jun Luo Bo Wan Yutai Su Guicui Fu Xu Long | 2022 | Computer Modeling in Engineering & Sciences2022，，2： | 1 |
| 2 | Impact Analysis of Microscopic Defect Types on the Macroscopic Crack Propagation in Sintered Silver Nanoparticles显示文摘Sintered silver nanoparticles(AgNPs)arewidely used in high-power electronics due to their exceptional properties.However,the material reliability is significantly affected by various microscopic defects.In this work,the three primary micro-defect types at potential stress concentrations in sintered AgNPs are identified,categorized,and quantified.Molecular dynamics(MD)simulations are employed to observe the failure evolution of different microscopic defects.The dominant mechanisms responsible for this evolution are dislocation nucleation and dislocation motion.At the same time,this paper clarifies the quantitative relationship between the tensile strain amount and the failure mechanism transitions of the three defect types by defining key strain points.The impact of defect types on the failure process is also discussed.Furthermore,traction-separation curves extracted from microscopic defect evolutions serve as a bridge to connect the macro-scale model.The validity of the crack propagation model is confirmed through tensile tests.Finally,we thoroughly analyze how micro-defect types influence macro-crack propagation and attempt to find supporting evidence from the MD model.Our findings provide a multi-perspective reference for the reliability analysis of sintered AgNPs. | Zhongqing Zhang Bo Wan Guicui Fu Yutai Su Zhaoxi Wu Xiangfen Wang Xu Long | 2024 | Computer Modeling in Engineering & Sciences2024，139，4： | 0 |
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