| 1 | Co‑packaged optics(CPO):status,challenges,and solutions显示文摘Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology. | Min Tan Jiang Xu Siyang Liu Junbo Feng Hua Zhang Chaonan Yao Shixi Chen Hangyu Guo Gengshi Han Zhanhao Wen Bao Chen Yu He Xuqiang Zheng Da Ming Yaowen Tu Qiang Fu Nan Qi Dan Li Li Geng Song Wen Fenghe Yang Huimin He Fengman Liu Haiyun Xue Yuhang Wang Ciyuan Qiu Guangcan Mi Yanbo Li Tianhai Chang Mingche Lai Luo Zhang Qinfen Hao Mengyuan Qin | 2023 | Frontiers of Optoelectronics2023，16，1： | 1 |
您所在的机构暂未开通此部分的功能，请联系管理员