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31篇 您的检索式：作者名="DOMFELD D"

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	题名	作者	年代	出处	被引量
1	A study on burr formation mechanism 显示文摘	Sung Lin Ko Domfeld D A	1991	ASME1991，113，1：	1
2	Pandemic influenza A viruses escape from restriction by human MxA through adaptive mutations in the nueleoprotein 显示文摘	Manz B Domfeld D Gotz V	2013	PLoS Pathog2013，9，3：	1
3	显示文摘	Luo Jianfeng Domfeld D A	2001	IEEE Transactions on Semiconductor Manufacturing2001，14，2：	1
4	Material removal mechanism in chemical mechanical polishing: theory and modeling 显示文摘	Luo J-F Domfeld D A	2001	IEEE Trans Semicond Manufac2001，14，2：	1
5	Preliminary investigation of the feasibility of using acousto-ultrasonics to measure defects in lumber显示文摘	Lemaster R L Domfeld D A	1987	Journal of Acoustic emission1987，，：	1
6	Quantitative Relation-ships for Acousticemission from Orthogonal Metal Cutting显示文摘	KANNATEY A E DOMFELD D A		0，，04：	1
7	Recent advances inmechanical micromachining 显示文摘	Domfeld D Min S Takeuchi Y	2006	CIRP Annals :Manufacturing Technology2006，55，2：	1
8	Advancing cutting technology显示文摘	BYME G DOMFELD D DENKENA R	2003	Annals of the CIRP2003，52，2：	1
9	Modeling of inter - layer gap formation in drilling of a multilayered material显示文摘	Choi J Min S Domfeld D A	2003	Proc of 6th CIRP international workshop on modeling of machining opera - tions Mc - master university hamilton2003，2003，5：	1
10	Integration of CAD of drill withFEA of drilling burr formation显示文摘	GUO Y B DOMFELD D A	1998	Trans North Am ManufRes Inst SME1998，26，：	1
11	Material removal mechanism in chemical mechanical polishing: Theory and modeling显示文摘	LUO J f DOMFELD D A	2001	IEEE Transactions on Semiconductor Manufacturing2001，14，2：	1
12	Material removal mechanisms in lapping and polishing 显示文摘	Evans C J Paul E Domfeld D	2003	Annals of the CIRP2003，52，1：	1
13	Material removal regions in chemical mechanical planarization for submicron integrated circuit fabrication: Coupling effects of slurry chemicals, abrasive size distribution,and wafer-pad contact area显示文摘	LUO J f DOMFELD D A	2003	IEEE Transactions on Semiconductor Manufacturing2003，16，1：	1
14	Analysis of acoustic emission in slow speed wood cutting显示文摘	Lemaster R L Klamecki B E Domfeld D A	1982	Wood Science1982，15，2：	1
15	An investigation of material removal mechanisms in lapping with grain size transition 显示文摘	Chang Y P Hanshimura M Domfeld D A	2000	Journal of Manufacturing Science and Engineering2000，122，：	1
16	Recent advances in mechanical micromachining显示文摘	DOMFELD D MIN S TAKEUCHI Y	2006	Annals of the CIRP2006，55，：	1
17	Advancing cutting technology 显示文摘	Byrne G Domfeld D Denkena B	2003	Manufacturing Technology2003，52，2：	1
18	Material removal mechanism in chemical mechanical polishing:Theory and modeling显示文摘	Luo Jianfeng Domfeld D A	2001	Transactions on Semiconductor Manufacturing2001，14，2：	1
19	Material removal mechanism in chemical mechanical polishing: theory and modeling 显示文摘	Luo J F Domfeld D A	2001	IEEE Transactions on Semiconductor Manufacturing2001，14，2：	1
20	Quantitative relationship for acoustic emission from orthogonal metal cutting显示文摘	KANNATEY-ASIBU JR E Domfeld D A	1981	Transaction oftheASME1981，103，3：	1

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