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您的检索式：作者名="Cosimo Lacava"
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| 1 | Coupling strategies for silicon photonics integrated chips[Invited]显示文摘Over the last 20 years, silicon photonics has revolutionized the field of integrated optics, providing a novel and powerful platform to build mass-producible optical circuits. One of the most attractive aspects of silicon photonics is its ability to provide extremely small optical components, whose typical dimensions are an order of magnitude smaller than those of optical fiber devices. This dimension difference makes the design of fiberto-chip interfaces challenging and, over the years, has stimulated considerable technical and research efforts in the field. Fiber-to-silicon photonic chip interfaces can be broadly divided into two principle categories:in-plane and out-of-plane couplers. Devices falling into the first category typically offer relatively high coupling efficiency, broad coupling bandwidth(in wavelength), and low polarization dependence but require relatively complex fabrication and assembly procedures that are not directly compatible with wafer-scale testing.Conversely, out-of-plane coupling devices offer lower efficiency, narrower bandwidth, and are usually polarization dependent. However, they are often more compatible with high-volume fabrication and packaging processes and allow for on-wafer access to any part of the optical circuit. In this paper, we review the current state-of-the-art of optical couplers for photonic integrated circuits, aiming to give to the reader a comprehensive and broad view of the field, identifying advantages and disadvantages of each solution. As fiber-to-chip couplers are inherently related to packaging technologies and the co-design of optical packages has become essential, we also review the main solutions currently used to package and assemble optical fibers with silicon-photonic integrated circuits. | RICCARDO MARCHETTI COSIMO LACAVA LEE CARROLL KAMIL GRADKOWSKI PAOLO MINZIONI | 2019 | Photonics Research2019，7，2： | 19 |
| 2 | Apodized silicon photonic grating couplers for mode-order conversion显示文摘An out-of-plane silicon grating coupler capable of mode-order conversion at the chip–fiber interface is designed and fabricated. Optimization of the structure is performed through finite-difference time-domain simulations,and the final device is characterized through far-field profile and transmission measurements. A coupling loss of 3.1 dB to a commercial two-mode fiber is measured for a single TE0→ LP11 mode conversion grating, which includes a conversion penalty of 1.3 dB. Far-field patterns of the excited LP11 mode profile are also reported. | IOSIF DEMIRTZIOGLOU COSIMO LACAVA ABDUL SHAKOOR ALI KHOKHAR YONGMIN JUNG DAVID J.THOMSON PERIKLIS PETROPOULOS | 2019 | Photonics Research2019，7，9： | 1 |
| 3 | High-efficiency reflector-less dual-level silicon photonic grating coupler显示文摘We present the design and experimentally demonstrate a dual-level grating coupler with subdecibel efficiency for a 220 nm thick silicon photonics waveguide which was fabricated starting from a 340 nm silicon-on-insulator wafer.The proposed device consists of two grating levels designed with two different linear apodizations,with opposite chirping signs,and whose period is varied for each scattering unit.A coupling efficiency of-0.8 d B at1550 nm is experimentally demonstrated,which represents the highest efficiency ever reported in the telecommunications C-band in a single-layer silicon grating structure without the use of any backreflector or indexmatching material between the fiber and the grating. | VALERIO VITALI THALíA DOMíNGUEZ BUCIO COSIMO LACAVA RICCARDO MARCHETTI LORENZO MASTRONAR TEERAPAT RUTIRAWUT GLENN CHURCHILL JOAQUíN FANECA JAMES C.GATES FREDERIC GARDES PERIKLIS PETROPOULOS | 2023 | Photonics Research2023，11，7： | 0 |
| 4 | Apodized silicon photonic grating couplers for mode-order conversion: publisher's note显示文摘 | Iosif Demirtzioglou Cosimo Lacava Abdul Shakoor Ali Khokhar Yongmin Jung David J.Thomson Periklis Petropoulos | 2019 | Photonics Research2019，7，11： | 0 |
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