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37篇 您的检索式：作者名="Chum C"

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	题名	作者	年代	出处	被引量
1	Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages显示文摘	Zhang F Li M Chum C	2002	Journal of Materials Research2002，17，11：	1
2	Structure/property relationship in polyolefins made by constrained geometry catalyst technology显示文摘	CHUM P S KAO C I KNIGHT G W	1995	Plast Eng1995，51，6：	1
3	Crack-heating and Mechanical Behavior of SiC/Al2O3 Composites at Elevated Temperature显示文摘	ANOD K KIM B S CHUM C	2004	Fatigue Fracture Engineering of Material Structures2004，27，：	1
4	Effective catalysis of simple metalloporphyrins for cyclohexane oxidation with air in the absence of additives and solvents 显示文摘	GUO C C CHUM F LIU Q	2003	Appl Cat A:Gen2003，246，2：	1
5	Effect of Sintering Additives on the Oxidation Behavior of Si3N4 Ceramics at 1300℃显示文摘	HOUJOU K ANDO L CHUM C	2005	Journal of the American Ceramic Society2005，25，5：	1
6	Symposium on biomass fuels: an introduction 显示文摘	Dayton D C Chum H L	1996	Energy Fuels1996，10，2：	1
7	Effect of Sintering Additives on the Oxidation Behavior of Si3N4 Ceramics at 1300℃显示文摘	HOUJOU K ANDO L CHUM C	2005	Journal of the American Ceramic Society2005，25，5：	1
8	HOXA10 regulates p53 expression and matrigel invasion in human breast cancer cells显示文摘	CHUM C SELAM F B TAYLOR H S	2004	Cancer Biol Ther2004，3，6：	1
9	Adhesion of polyeth- ylene blends to polypropylene 显示文摘	Pooh B C Chum S P Hiltner A	2004	Polymer2004，45，：	1
10	Effects of substratemetallizations on solder/underbump metallization interfacialreactions in flip-chip packages during thermal aging 显示文摘	ZHANG F LI M CHUM C C TUNG C H	2003	Journalof Materials Research2003，18，6：	1
11	Ultralow loss dielectric ribbon waveguide for millimeter/submillimeter waves显示文摘	Yeh C Shimahukuro F I Chum J	1989	Applied Physics Letters1989，54，：	1
12	A study on melt grafting ofmaleic anhydride onto low density polyethylene and its blend with polyamide6显示文摘	CHUM C IQBAL M TIAN S	2010	Journal of Polymer Science Part B: Polymer Physics2010，48，3：	1
13	显示文摘	Zhang F Li M Chum C C	2002	J Mater Res2002，17，：	1
14	Crack healing behaviour and high-temperature strength of mullite/SiC composite ceramics 显示文摘	ANDO K CHUM C TSUJI k	2002	Journal of the European Ceramic Society2002，22，：	1
15	Structure/Property Relationships in Polyolefins Made by Constrained Geometry Catalyst Technology显示文摘	Chum P S Kao C I Knight G W	1995	Plast Eng1995，51，6：	1
16	Effects of substrate met- allization on solder/under - bump metallization interfacial reactions in flip - chip packages during multiple reflow cycles 显示文摘	Zhang F Li M Chum C C	2003	Journal of Electronic Materials2003，32，3：	1
17	Functional properties of lyophilized hemoglobin in the presence of amino acids after 13 months of conservation显示文摘	Labrude P Chum C Pelgrims F	1980	Experientia1980，37，9：	1
18	Hot bath-related headache controlled by topiramate 显示文摘	LEE J YUN C H CHUM K	2007	Cephalalgia2007，27，5：	1
19	Estimation of Thermal Deformation in Machine Tools Using the Hybrid Autoregressive Moving-average-neural Network Model 显示文摘	KANG Y CHANG C W CHUM H	2006	Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture2006，220，8：	1
20	Structure/property relationship in palyolefins made by constrained geometry catalyst technology显示文摘	Kao C I Knight G W	1995	Plast Eng1995，51，6：	1

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