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		题名	作者	年代	出处	被引量
	1	Defects and Electron Densities in TiAl-based Alloys Containing Mn and Cu Studied by Positron Annihilation显示文摘The defects and electron densities in Ti50Al50, Ti50Al48Mn2 and Ti50Al48Cu2 alloys have been studied by positron lifetime measurements. The results show that the free electron density in the bulk of binary TiAl alloy is lower than that of pure Ti or Al metal. The open volume of defects on the grain boundaries of binary TiAl alloy is larger than that of a monovacancy of Al metal. The additions of Mn and Cu into Ti-rich TiAl alloy will increase the free electron densities in the bulk and the grain boundary simultaneously, since one Mn atom or Cu atom which occupies the Al atom site provides more free electrons participating metallic bonds than those provided by an Al atom. It is also found the free electron density in the grain boundary of Ti50Al48Cu2 is higher than that of Ti50Al48Mn2 alloy, while the free electron density in the bulk of Ti50Al48Cu2 is lower than that of Ti50Al48Mn2 alloy. The behaviors of Mn and Cu atoms in TiAl alloy have been discussed.	WenDENG DingkangXIONG JingyangWang LiangyueXIONG MingzhouCAO ChiweiLUNG	2003	Journal of Materials Science & Technology2003，19，2：	0
	2	Reliability of Measured Fractal Dimension and Roughness Exponent as Materials Dimensionless Parameters for Fracture Surfaces显示文摘The effects of accuracy of measured fractal dimension D and roughness exponent H are investigated in this paperwith a view to examine the reliability of D and H as materials dimensionless parameters of fracture surfaces. Dand H are different from general physical quantity, because they are dimensionless quantities and often appear asexponents in a theoretical function or formula. In many cases, the error of the physical quantity related to D or Hmay far exceed 10%, if D or H has error around 10%. The required accuracy of fractal dimension and roughnessexponent should be higher, but it depends on the specific material, the associated physical quantity and the scale ofmeasurement.	ShenggangWANG HanlonKLI ChiweiLUNG	2003	Journal of Materials Science & Technology2003，19，5：	0

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