维普期刊资源整合服务平台（V6.5）

44篇 您的检索式：作者名="Chein R"

选中清除导出查看参考文献查看引证文献引用追踪共3页首页上一页第1页下一页末页 /3 跳转

	题名	作者	年代	出处	被引量
1	Numerical study of the inlet/outlet arrangement effect on microchannel heat sink perforraance显示文摘	Chein R Chen J	2009	International Journal o J Thermal Sciences2009，48，8：	1
2	Numerical study of the inlet/outlet ar- rangement effect on mierochannel heat sink performance 显示文摘	CHEIN R CHEN J	2009	International Journal of Thermal Sciences2009，48，8：	1
3	Numerical study of the inlet/outlet arrange -ment effect on microchannel heat sink performance显示文摘	Chein R Chen J	2009	Inter -national Journal of Thermal Sciences2009，48，8：	1
4	Experimental microchannel heat sink performance studies using nanofluids显示文摘	Chein R Chuang J	2007	Thermal Sciences2007，46，：	1
5	Planning collision- free paths for robotic arm among obstaeles显示文摘	Chein R T	1986	IEEE Transaction on Pattern Analysis and Machine Intelligence1986，6，1：	1
6	Experimental microchannel heat sink performance studies using nanofluids 显示文摘	Chein R Chuang J	2007	International Journal of Thermal Sciences2007，46，：	1
7	Thermoelectric cooler application in electronic cooling显示文摘	Chein R Huang G	2004	Applied Thermal Engineering2004，24，1415：	1
8	New Electroforming Technology Pressure Aid for LIGA Process显示文摘	Tsai T H Yang H Chein R	2004	Microsystem Technologies2004，10，5：	1
9	Thermoelectric cooler application in electronic cooling显示文摘	Chein R Huang G		0，，14：	1
10	Experimental Microchannel Heat Sink Performance Studies Using Nanofluids 显示文摘	Chein R Chuang J	2007	International Journal of Thermal Sciences2007，46，：	1
11	Effects of vortex pairing on par- ticle dispersion in turbulent shear flows 显示文摘	CHEIN R CHUNG J N	1987	International Journal of Muhiphase Flow1987，13，6：	1
12	Experimental Study of Heat Sink Performance Using Copper Foams Fabricated by Eleetroforming 显示文摘	Chein R Yang H Tsai T H	2010	Microsystem technologies2010，16，11：	1
13	New electroforming tech- nology pressure aid for LIGA process显示文摘	TSAI T H YANG H CHEIN R	2004	Microsystem Tech- nologies2004，10，5：	1
14	Analysis of microchannel heat sink performance using nanofluids 显示文摘	CHEIN R HUANG G M	2005	Applied Thermal Engineering2005，25，1718：	1
15	Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance显示文摘	Chein R Chen J		0，，08：	1
16	Performances of thermoelectric cooler integrated with micro-channel heat sinks 显示文摘	Chein R Y Chen Y H	2005	Int J Refrig2005，，28：	1
17	Thermoelectric cooler application in electronic cooling 显示文摘	Chein R Y Huang G M	2004	Appl Therm Eng2004，，24：	1
18	Experimental microchannel heat sinkperformance studies using nanofluids显示文摘	Chein R Chuang J	2007	International Journal of Thermal Sciences2007，46，：	1
19	Domain-general mechanisms of complex working memory span显示文摘	Chein J M Moore A B Conway R A		0，，01：	1
20	New eleetroforming technology pressure aid for LIGA process 显示文摘	TSAI T H YANG H CHEIN R	2004	Microsystem Technologies2004，10，5：	1

返回顶部每页显示：

共3页首页上一页第1页下一页末页 /3 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示