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26篇 您的检索式：作者名="CLODE M P"

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	题名	作者	年代	出处	被引量
1	A constitutive model and its identi-fication for the deformation characterized by dynamic recovery显示文摘	ZHOU M CLODE M P	1997	Journal of Engineering Materials and Technology1997，119，：	1
2	Constitutive equations for modelingflow softening due to dynamic recovery and heat generationduring plastic deformation显示文摘	ZHOU M CLODE M P	1998	Mechanics of Materials1998，27，：	1
3	Constitutive equations for modeling flowsoftening due to dynamic recovery and heat generation duringplastic deformation 显示文摘	Clode M P Zhou M	1998	Mechanics of Materials1998，27，2：	1
4	Constitutive equations for model in flow softening due to dynamic recovery and heat generation during plastic deforrnation显示文摘	ZHOU M CLODE M P	1998	Mechanics of Materials1998，27，2：	1
5	Hot torsion tests to model the deformation behavior of aluminium alloys at hot working temperatures显示文摘	Zhou M Clode M P	1997	Journal of Materials Processing Technology1997，72，1：	1
6	A constitutive model and its identification for the deformation characterized by dynamic recovery显示文摘	Zhou M Clode M P	1997	Journal of Engineering Materials and Technology1997，119，：	1
7	Materials and processes for implementing high-temperature liquid interconnects 显示文摘	MANNAN S H CLODE M P	2004	IEEE Transactions on Advanced Packaging2004，27，3：	1
8	Comparisons of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders 显示文摘	Li J F Mannan S H Clode M P	2007	Acta Mater2007，55，2：	1
9	A constitutive model and its identification for the deformation characterized by dynamic revovery 显示文摘	Zhou M Clode M P	1997	Journal of Engineering Materials and Technology Transaction of the ASME1997，119，：	1
10	Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation 显示文摘	Zhou M Clode M P	1998	Mechanics of Materials1998，，27：	1
11	Comparisons of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders显示文摘	Lia J F Mannan S H Clode M P	2007	Acta Mater2007，，55：	1
12	Interme- tallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates显示文摘	KOTADIA H R MOKHTARI O CLODE M P	2012	Journal of Alloys and Compounds2012，511，1：	1
13	Constitutive equations for modeling flow softening due to dynamic recovery and heat generation during plastic deformation显示文摘	ZHOU M CLODE M P	1998	Mechanics of Materials1998，27，2：	1
14	Materials and processes for implemen- ting high-temperature liquid interconnects 显示文摘	Mannan S H Clode M P	2004	Advanced Packa- ging2004，27，3：	1
15	On computer simulation methods to model Zener pinning显示文摘	HARUN A HOLM E A CLODE M P MIODOWNIK M A	2006	Acta Materialia2006，54，12：	1
16	A constitutive model and its identification for the deformation charactered by dynamic recovery 显示文摘	ZHOU M CLODE M P	1997	Transactions of the ASME1997，119，：	1
17	Comparisons of interfacial reactions of Ni and Ni - P in extended contact with liquid Sn - Bi - based solders 显示文摘	Lia J F Mannan S H Clode M P	2007	Acta Mater2007，55，：	1
18	Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects 显示文摘	LI J F MANNAN S H CLODE M P HUTT D A	2006	Acta Materialia2006，54，11：	1
19	Constitutive Equations for Modeling Flow Softening Due to Dynamic Recovery and Heat Generation During Plastic Deformation 显示文摘	ZHOU M CLODE M P	1998	Mechanics of Materials1998，27，2：	1
20	Constitutive equations for modelling flow softening due to dynamic recovery and heat generation during plastic deformation显示文摘	Zhou M Clode M P	1998	Mechanics of Materials1998，27，：	1

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