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34篇 您的检索式：作者名="BASIM G B"

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	题名	作者	年代	出处	被引量
1	Effect of particle size of chemical mechanical polishing slurries for enhanced polishing with minimal defects显示文摘	Basim G B A dler J J M aha Jan U	2000	Elecrochem Soc2000，147，35：	1
2	Effect of Particle Size Distribution of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects 显示文摘	Basim G B Adler J J Mahajan U Singh R K and Moudgil B M	2000	Journal of The Electrochemical Society2000，147，9：	1
3	Effect of soft agglomerates on CMP slurry performance显示文摘	Basim B G Moudgil B M	2002	Journal of Colloid and Inter- face Science2002，256，：	1
4	Effect of Particle Size of Chemical Mechanical Polishing Slur- ries for Enhanced Polishing with Minimal Defects 显示文摘	Basim G B Adler J J Mahajan U	2000	Journal of the Electrochemical Society2000，147，9：	1
5	Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects显示文摘	Basim G B Adler J J Mahajan U	2000	Journal of the Electrochemical Society2000，147，9：	1
6	Effect of soft agglomerates on CMP slurry performance显示文摘	Basim G B Moudgil B M	2002	Journal of Colloid and Interface Science2002，256，：	1
7	Effect of particle size of chemical mechanical polishing slurries for en- hanced polishing with minimal defects 显示文摘	Basim G B Adler J J Mahajan U	2000	Journal of the Electrochemical Society2000，147，9：	1
8	Effect of particle size of chemical mechanical polishing slurries for enhanced polishing with minimal defects 显示文摘	Basim G B Adler J J Mahajan U	2000	Journal of the Elecrochemical Society2000，147，9：	1
9	Surfactant me- diated slurry formulations for Ge CMP applications 显示文摘	BASIM G B KARAGOZ A CHEN L	2013	MRS Online Proceeding Library2013，1560，：	1
10	Improving selectivity on germa- nium CMP applications 显示文摘	KARAGOZ A BASIM G B	2014	ECS Transactions2014，61，17：	1
11	Understanding selec- tivity on germanium/SiO2 chemical mechanical planarization through design of experiments 显示文摘	KARAGOZ A MAL J BASIM G B	2015	MRS Online Proceeding Library2015，1790，：	1
12	Controlling germanium CMP selec- tivity through slurry mediation by surface active agents 显示文摘	KARAGOZ A BASIM G B	2015	ECSJ Solid State Sci Technol2015，4，11：	1
13	Effect of soft agglomentes on CMP slurry performance 显示文摘	BASIM G B MOUDGIL B M	2002	Journal of Colloid and Interfaee Science2002，256，1：	1
14	Role of interaction forces in controlling the stability and polishing performance of CMP slurries 显示文摘	BASIM G B VAKARELSKI 1 U MOUDGIL I3 M	2003	Journal of Colloid and Interface Science2003，263，2：	1
15	Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects 显示文摘	Basim G B Adler J J Mahajan U	2000	Journal of The Electrochemical Society2000，147，9：	1
16	Effect of Soft Agglomerates on CMP Slurry Performance显示文摘	Basim G B Moudgil B M	2002	Journal of Colloid and Interface Science2002，256，：	1
17	Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects显示文摘	Adler J J Mahajan U	2000	Journal of the Electrochemical Society2000，147，9：	1
18	Effect of slurry aging on stability and perfor- mance of chemical mechanical planarization process 显示文摘	BASIM G B	2011	Ad- vanced Powder Technology2011，22，2：	1
19	Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects 显示文摘	G B Basim J J Adler U Mahajan	2000	Electrochemical Society2000，147，9：	1
20	Effect of particle size chemical mechanical polishing slurries for enhanced polishing with minimal defects显示文摘	Basim G B Adler J J Mahajan U	2000	J Electrochem Soc2000，147，9：	1

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