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14篇 您的检索式:作者名="Arijit M"
    题名 作者 年代 出处 被引量
1Modification of polyvinyl butyral rheological properties via blending with ionomeric polyvinyl butyral显示文摘Das Gupta Arijit M 1991Polym Bull (Berlin)1991,25,6:1
2Current crowding effect on copper dual-damscene via bottom failure for ULSI applications 显示文摘TAN C M ARIJIT R VAIRAGAR A V 2005IEEE Transactions Device and Materials Reliability2005,5,2:1
3Disclosure or secrecy? The dynamics of open science 显示文摘Arijit M Scott S 2009International Journal of Industrial Organization2009,27,3:1
4Integrating AHP with QFD for robot selection under requirement perspective 显示文摘ARIJIT B BIJAN S SANAT K M 2005International Journal of Production Research2005,43,17:1
5Conditions for generation of stable and accurate hybrid TDFD MoM solutions显示文摘YUAN M ARIJIT D JUNG B H 2006IEEE Transactions on Microwave Theory and Techniques2006,54,1:1
6Integrating AHP with QFD for robot selection under requirement perspective显示文摘Arijit B Bijan S Sanat Kumar M 2005International Journal of Production Research2005,43,17:1
7Transmission and reception by ultra-wideband (UWB) antennas显示文摘Debalina G Arijit D Taylar M C 2006IEEE Antennas and Propagation Magazine2006,48,5:1
8Technology licensing policy in a differentiated oligopoly 显示文摘Bagchi A Arijit M 2013International Review of Economics and Finance2013,29,2:1
9Determination of allowable penetration levels of distributed generation resources based on harmonic limit considerations显示文摘ARIJIT B ARINDAM M MARK H 2003IEEE Transactions on Power Delivery2003,18,2:1
10Effects of hypoxia and intracellular iron chelation on hypoxia-inducible factor 1α and 1β in the rat carotid body and glomus cells显示文摘SANTHOSH M B ARIJIT R ANIL M M 2003Histochem Cell Biol2003,120,5:1
11Transmission and reception by ultra-wideband (UWB) antennas 显示文摘Ghosh D de Arijit Taylor M C 2006IEEE Antennas and Propagation Magazine2006,48,5:1
12Modification of polyvinyl butyral rheological properties via blending with ionomeric polyvinyl butyral显示文摘DASGUPTA ARIJIT M DAVID DONALD J el al 1991Poly-mer Bulletin (Berlin)1991,25,6:1
13Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect显示文摘ARIJIT R CHER M T 2006Microelectronics & Reliability2006,46,:1
14Electromigration in ULSI interconnects显示文摘CHER M T ARIJIT R 2007Materials Science and Engineering:R2007,58,12:1
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