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| 1 | MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies显示文摘MEMS inductors are used in a wide range of applications in micro-and nanotechnology,including RF MEMS,sensors,power electronics,and Bio-MEMS.Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance.This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication,presents recent advances in 3D additive fabrication technologies,and discusses the challenges and opportunities of MEMS inductors for two emerging applications,namely,integrated power electronics and neurotechnologies.Among the four top-down MEMS fabrication approaches,3D surface micromachining and through-substrate-via(TSV)fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors.While 3D inductors are preferred for their high-quality factor,high power density,and low parasitic capacitance,in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation.These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters.From another perspective,3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies.Finally,we discuss inspiring and emerging research opportunities for MEMS inductors. | Hoa Thanh Le Rubaiyet I.Haque Ziwei Ouyang Seung Woo Lee Shelley I.Fried Ding Zhao Min Qiu Anpan Han | 2021 | Microsystems & Nanoengineering2021，7，4： | 2 |
| 2 | Ice lithography for 3D nanofabrication显示文摘Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography, which makes 2 D patterns down to a few nanometers, is one of the fundamental pillars of nanofabrication.Recently, significant progress in 3 D electron-beam-based nanofabrication has been made, such as the emerging ice lithography technology, in which ice thin-films are patterned by a focused electronbeam. Here, we review the history and progress of ice lithography, and focus on its applications in efficient 3 D nanofabrication and additive manufacturing or nanoscale 3 D printing. The finest linewidth made using frozen octane is below 5 nm, and nanostructures can be fabricated in selected areas on non-planar surfaces such as freely suspended nanotubes or nanowires. As developing custom instruments is required to advance this emerging technology, we discuss the evolution of ice lithography instruments and highlight major instrumentation advances. Finally, we present the perspectives of 3 D printing of functional materials using organic ices. We believe that we barely scratched the surface of this new and exciting research area, and we hope that this review will stimulate cutting-edge and interdisciplinary research that exploits the undiscovered potentials of ice lithography for 3 D photonics, electronics and 3 D nanodevices for biology and medicine. | Ding Zhao Anpan Han Min Qiu | 2019 | Science Bulletin2019，64，12： | 1 |
| 3 | Fabrication of 3D air-core MEMS inductors for very-highfrequency power conversions显示文摘We report a fabrication technology for 3D air-core inductors for small footprint and very-high-frequency power conversions.Our process is scalable and highly generic for fabricating inductors with a wide range of geometries and core shapes.We demonstrate spiral,solenoid,and toroidal inductors,a toroidal transformer and inductor with advanced geometries that cannot be produced by wire winding technology.The inductors are embedded in a silicon substrate and consist of through-silicon vias and suspended windings.The inductors fabricated with 20 and 25 turns and 280-350μm heights on 4-16 mm2 footprints have an inductance from 34.2 to 44.6 nH and a quality factor from 10 to 13 at frequencies ranging from 30 to 72 MHz.The air-core inductors show threefold lower parasitic capacitance and up to a 140% higher-quality factor and a 230% higher-operation frequency than silicon-core inductors.A 33 MHz boost converter mounted with an air-core toroidal inductor achieves an efficiency of 68.2%,which is better than converters mounted with a Si-core inductor(64.1%).Our inductors show good thermal cycling stability,and they are mechanically stable after vibration and 2-m-drop tests. | Hoa Thanh Le Io Mizushima Yasser Nour Peter Torben Tang Arnold Knott Ziwei Ouyang Flemming Jensen Anpan Han | 2018 | Microsystems & Nanoengineering2018，4，1： | 0 |
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