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2篇 您的检索式:作者名="A.L.Fan"
    题名 作者 年代 出处 被引量
1AFM STUDY ON THE MORPHOLOGICAL CHANGE OF Zn ELECTRODEPOSIT显示文摘Nano-sized growth of zinc electrodeposit on the ferrite substrate has been studied by means of in situ scanning tunnel microscopy (STM) and atomic force micoscopy (AFM). It is found that the morphology of zinc electrodeposit varies from initial about 30nm granular crystals to layered platelet crystals with increasing deposition time by using in situ STM. With AFM, the results show that the platelet crystals ave hexagonal in shape and the hexagonal platelet crystals form steps perpendicular to the growth direction by side-by-side stacking along the (0001), surface. The mechanism of morphological change is discussed in details. It is proposed that these steps grow laterally as a result of the embedment of zinc ion clusters.A.L.Fan W.H.Tian M.Kurosaki 2003Acta Metallurgica Sinica(English Letters)2003,16,5:0
2PLASTIC DEFORMATION BEHAVIOR OF ELECTROFORMED COPPER LINER OF SHAPED CHARGE AT DIFFERENT STRAIN RATES显示文摘The paper deals with different plastic deformation behavior of electroformed copperliner of shaped charge, deformed at high strain rate (about 1×107 s-1) and normalstrain rate (4×10-4 s-1). The crystallographic orientation distribution of grains inrecovered slugs which had undergone high-strain-rate plastic deformation during ex-plosive detonation was investigated by electron backscattering Kikuchi pattern tech-nique. Cellular structures formed by tangled dislocations and sub-grain boundariesconsisting of dislocation arrays were detected in the recovered slugs. Some twins andslip dislocations were observed in specimen deformed at normal strain rate. It wasfound that dynamic recovery and recrystallization take place during high-strain-ratedeformation due to the temperature rising, whereas the conventional slip mechanismoperates during deformation at normal strain rate.H.Y.Gao W.H.Tian A.L.Fan Q.Sun 2003Acta Metallurgica Sinica(English Letters)2003,16,1:0
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