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59篇 您的检索式:期刊名="Solid State Technol"
    题名 作者 年代 出处 被引量
1The nitrogen-pair oxygen defect in silicon显示文摘Rasmussen F B Oberg S Jones R 1996Mater Sci Eng B: Solid State Mater Adv Technol1996,36,13:1
2Advanced IC packaging:markets and trends显示文摘 2001Solid State Technol2001,44,4:1
3Cordierite glass-ceramics for dielectric materials 显示文摘SIT M N SALYED M A SELAMAT M 2007Solid State Sci Technol2007,909,:1
4Oxide CMP mechanisms 显示文摘Minoru Tomozawa 1997Solid State Technol1997,40,7:1
5The early days of CMP显示文摘Michael A F 1997Solid State Technol1997,40,5:1
6Oxide CMP mechanisms显示文摘Minoru T 1997Solid State Technol1997,40,7:1
7The early days of CMP显示文摘Fury Michael A 1997Solid State Technol1997,40,5:1
8Combustion Synthesis of Eu2+ Doped/3-SiA1ON Phosphors by Salt Assistance 显示文摘Xu K He G Liu G 2013ECS J Solid State Sci Technol2013,2,11:1
9Chemical-mechanical polishing ofinterlay dielectric 显示文摘All I Roy S Shinn G 1994A review Solid State Technol1994,,10:1
10Synthesis and characterization of the bulk crystalline carbon-nitride phase synthesised by high-pressure technique显示文摘DYMONT V P SMUROV I 2001Mater Sci Eng B Solid State Mater Adv Technol2001,82,13:1
11Continuous deionization in the preparation of microelectronics-grade water 显示文摘Wilkins F R Mcconnelee P A 1988Solid State Technol1988,31,8:1
12High dielectric thick film for screened circuit capacitors显示文摘Ulrich D R 1969Solid State Technol1969,12,:1
13Emerging Developments in CMP for Semiconductor Planarization-part 2显示文摘Fury M A 1995Solid State Technol1995,38,7:1
14Oxide CMP mechanisms显示文摘Tomozawa M 1997Solid State Technol1997,40,7:1
15In the age of 300 mm silicon, technology standards are even more crucial 显示文摘GEHMAN B L 2001Solid State Technol2001,44,:1
16Advamced wet and dry cleaning coming together for next generation显示文摘Heyns M P W Mertens J Ruzyllo M L 1999Solid state technol1999,42,:1
17A supported titanium based catalyst for in-situ hydrogen sulphide desulphurization and carbon dioxide methanation reaction in natural gas显示文摘MOHAMAD NASIR J WAN ABU BAKAR W A OTHMAN M Y 2007Solid State Sci Technol2007,15,2:1
18The Effect of Porosity on Mechanical,Elec-trical and the Thermal Characteristics of Conductive Die-attach Adhesives显示文摘ESTES R H 1984Solid State Technol1984,,8:1
19显示文摘Gu F Shen Y Liang X F 2003Mater Sci Eng B Solid State Adv Technol2003,99,13:1
20The early days of CMP显示文摘FURY M A 1997Solid State Technol1997,40,5:1
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