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36篇 您的检索式：期刊名="Mieroelectronics reliability"

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	题名	作者	年代	出处	被引量
1	Measurement of the hot earrier damage profile in LDMOS devices stressed at high drain voltage 显示文摘	Uorso D Aurite S Sciacca E	2007	Mieroelectronics Reliability2007，47，45：	1
2	Bayesian inference for partially accelerated life tests using gibbs sampling 显示文摘	MADI M T	1997	Mieroelectron Reliability1997，37，8：	1
3	Reliability analysis of hypercube multi-computers 显示文摘	Tripath C R	1997	Mieroelectron Reliability1997，37，6：	1
4	Sulfur-contamination of high power white LED 显示文摘	Mura G Cassanelli G Fantini F	2008	Mieroelectronics Reliability2008，48，：	1
5	Time-series models for reliability evaluation of power systems including wind energy 显示文摘	Billinton R Chen H Ghajar R	1996	Mieroelectronics Reliability1996，36，9：	1
6	A note on 'using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assem- bly' 显示文摘	Li Dengfeng	2008	Mieroelectronics Reliability2008，48，10：	1
7	Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications显示文摘	Tee T Y Ng H S Yapa D	2003	Mieroelectronics Reliability2003，43，7：	1
8	A new formula and an algorithm for reliability analysis of network 显示文摘	Zhao L C Kong F J	1997	Mieroelectron Reliability1997，37，4：	1
9	Fuzzy fault-tree analysis using failure possibility显示文摘	Liang Gin-Shuh Wang Mao-Jiun	1993	Mieroelectronics and Reliability1993，33，4：	1
10	Unified soft breakdown MOSFETs compact model: From experiments to circuit sim- ulation 显示文摘	Gerrer L Rafik M Ribes G	2010	Mieroelectronics Reliability2010，50，8：	1
11	An introduction to the studies of reliability of systems using the Weibull proportional hazards model显示文摘	JOZWIAK I J	1997	Mieroelectronics Reliability1997，37，6：	1
12	Analysis of Humidity Effects on the Degradation of High-power White LEDs显示文摘	Tan C M Chen B K E Xu G	2009	Mieroelectronics Reliability2009，49，911：	1
13	Common -cause failure analys is of a non -idential unit parallel system with arbitrarily distributed repair times显示文摘	DHILLON BS ANUDED O C	1993	Mieroelectron Reliability1993，33，1：	1
14	Solder-joint reliability of HVQFN-packges subject to thermal cycling显示文摘	De Vries J Jansen M van Driel W	2009	Mieroelectronics Reliability2009，49，3：	1
15	显示文摘	Luo J F Ji Y Zhong T X	2006	Mieroelectronics Reliability2006，46，：	1
16	Solder joint reliability evaluation of chip scale package using a modified coffin-manson equation显示文摘	Shohji I Mori H Orii Y	2004	Mieroelectronics reliability2004，44，：	1
17	Three-dimenslonal voids simulation in chip-level metallization structures: a contribution to reliability evaluation 显示文摘	Dalleau D Weide-Zaage K	2001	Mieroelectronics Reliability2001，41，910：	1
18	3D modeling of electromigration combined with thermal-mechanical effect for IC devices and package 显示文摘	Liu Y Liang L H Irving S Luk T	2008	Mieroelectronics Reliability2008，48，6：	1
19	Study on the Shear Strength Degradation of ACA Joints Induced by Different Hy- grothermal Aging Conditions显示文摘	WU Guang-hua BO Tao YIN Zhou-ping	2013	Mieroelectronics Reliability2013，，6：	1
20	New practical Bayes estimates for the 2-parameter Weibull distribution 显示文摘	Erto P	1994	Mieroelectronics Reliability1994，34，5：	1

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