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15篇 您的检索式：期刊名="Microeletronics reliability"

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		题名	作者	年代	出处	被引量
	1	A statistical distribution function of wide applicability显示文摘	Weibull W	1951	Journal of Applied Microeletron Reliability1951，28，4：	1
	2	A model for residual life prediction based on Brownian motion with an adaptive drift显示文摘	WANG Wenbin Carr M XU Wenjia	2010	Microeletronics Reliability2010，51，2：	1
	3	Thermal properties of diamond/ copper composite material显示文摘	Yoshida K Morigami H	2004	Microeletronics Reliability2004，44，：	1
	4	Development of Gold to Gold Interconnection Flip Chip Bonding for Chip On Suspension Assemblies 显示文摘	Luk C F Chan Y C Hung K C	2002	Microeletronics reliability2002，，12：	1
	5	Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies 显示文摘	Luk C F Chan Y C Hung K C	2002	Microeletronics reliability2002，，12：	1
	6	Laser processing for microelectronics packaging applications显示文摘	Zsolt I V	2001	Microeletronics Reliability2001，41，4：	1
	7	Bayesian tech- niques to reduce the sample size in automotive electronics at- tribute testing显示文摘	Kleyner A Bhagath S Gasparini M	1997	Microeletronics Reliability1997，37，6：	1
	8	Laser processing for microelectronics packaging applications 显示文摘	Vitez Z I	2001	Microeletronics Reliability2001，41，4：	1
	9	Development of gold to gold interconnection flip chip bonding for chip on the suspension assemblies显示文摘	LUK C F CHAN Y C HUNG K C	2002	Microeletronics Reliability2002，42，3：	1
	10	Single- quantum well InGaN green light emitting diode degradtion under high electrical stress显示文摘	BARTON D L OSINSKI M PERLIN P	1999	Microeletronics Reliability1999，39，8：	1
	11	Laser processing for microelectronics packaging applications显示文摘	Zsolt I V	2001	Microeletronics Reliability2001，41，4：	1
	12	Development of gold to gold interconnection flip chip bonding for chip on suspen2sion assemblies显示文摘	Luk C F Chan Y C Hung K C	2002	Microeletronics reliability2002，，12：	1
	13	Field failure due to creep corrosion on components with palladium preplated leadfra- mes显示文摘	Zhao P Pecht M	2003	Microeletronics Reliability2003，43，5：	1
	14	Stochastic analysis of a repairable system with three units and two repair facilities显示文摘	Li W Alfa A S Zhao Y Q	1998	Microeletronics and Reliability1998，38，4：	1
	15	Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies 显示文摘	Luk C F Chan Y C Hung K C	2002	Microeletronics Reliability2002，42，3：	1

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