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28篇 您的检索式：期刊名="Microeleetronic Reliability"

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	题名	作者	年代	出处	被引量
1	Transition from flip chip solder joint to 3D IC microbump: its effect on microstrueture anisotropy 显示文摘	Tu K N Hsiao H Y Chen C	2013	Microeleetronics Reliability2013，53，1：	1
2	Two-dimensional transient simulations of the self-heating effects in GaN-based HEMTs 显示文摘	Zhang Y Feng S Zhu H	2013	Microeleetronics Reliability2013，53，5：	1
3	Modeling and measurement approaches for electrostatic discharge in semiconductor devices and ICs: an o- verview显示文摘	Lee J C Croft G D	1999	Microeleetronic Reliability1999，39，5：	1
4	Timed Petri nets definitions, properties and applications 显示文摘	Zuberek W M	1991	Microeleetronics and Reliability (S0026-2714)1991，31，4：	1
5	Time-series models for reliability evaluation of power systems including wind energy 显示文摘	BILLINTON R CHEN H GHAJAR R	1996	Microeleetronics Reliability1996，36，9：	1
6	Qualifiea-tion of bumping processes : experimental and numerical investiga- tions on mechanical stress and failure modes induced by shear test 显示文摘	Gallois-Garreignot S Benzima N Benmussa E	2015	Microeleetronics Reliability2015，55，6：	1
7	Extractionof accurate thermal compact models for fast electro- thermal simulation of IGBT modules in hybrid elec- tric vehicles显示文摘	Ciappa M Fichtner W Kojima T	2005	Microeleetronics Reliability2005，45，911：	1
8	Cu/low-k die- lectric TDDB reliability issues for advanced CMOS tech- nologies 显示文摘	CHEN F BRAVO O HARMON D	2008	Microeleetronics Reliability2008，48，：	1
9	Optimal planned maintenance with salvage cost for a two-unit standby redundant system显示文摘	DOHI T OSAKI S KAIO NAOTO	1996	Microeleetronics Reliability1996，36，：	1
10	Solder joint fatigue models: review and applicability to chip scale packages 显示文摘	Lee W W Nguyen L T Selvaduray G S	2000	Microeleetronics Reliability2000，40，2：	1
11	Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding显示文摘	Guo R Gao L M Mao D L	2014	Microeleetronics Reliability2014，54，：	1
12	New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions 显示文摘	Barlini D Ciappa M Castellazzi A	2006	Microeleetronics Reliability2006，46，9：	1
13	Special issue on prognostics and health man- agement 显示文摘	Lau D Fong B	2011	Microeleetronics Reliability2011，51，2：	1
14	Effect of Cr additions on interracial reaction between the Sn-Zn- Bi solder and Cu/electroplated Ni substrates 显示文摘	Bi J L Hu A M Hu J	2011	Microeleetronics Reliability2011，51，3：	1
15	Vibration reliability test and finite element analysis for flip chip solder joints 显示文摘	Che F X Pang l H L	2009	Microeleetronics Reliability2009，49，6：	1
16	Confidence limits for steady state availability of systems显示文摘	CHANDRASEKHAR P NATARAJAN R SUJATHA H S	1997	Microeleetronics and Reliability1997，34，8：	1
17	Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition 显示文摘	Lai Y S Yang P F Yeh C L	2006	Microeleetronics Reliability2006，46，24：	1
18	Thermal properties of diamond/copper composite material 显示文摘	Katsuhito Yoshida Hideaki Morigami	2004	Microeleetronics Reliability2004，44，：	1
19	Thermal pro- perties of diamond/copper composite material 显示文摘	YOSHIDA K MORIGAMI H	2004	Microeleetronics Reliability2004，44，2：	1
20	The influence of solder composition on the impact strength of lead-free solder ball grid array joints 显示文摘	Tsukamoto H Nishimura T Suenaga S	2011	Microeleetronics Reliability2011，51，：	1

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