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1666篇 您的检索式：期刊名="Microelectronic Engineer"

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	题名	作者	年代	出处	被引量
1	Application of soft landing to the process control of chemical mechanical polishing显示文摘	Chiu J B Yu C C Shen S H	2003	Microelectronic Engineering2003，65，3：	2
2	Technological innovation in low- dose SIMOX wafers fabricated by an internal thermal oxidation (ITOX) process 显示文摘	Matsummura A Hamaguchi I Kawamura K	2003	Microelectronic Engineering2003，66，：	2
3	Fabrication of Ge2Sb2Te5 based PRAM device at 60 nm scale by using UV nanoimprint lithography显示文摘	Lee H Hong S H Yang K Y	2007	Microelectronic Engineering2007，84，：	1
4	Design and fabrication of a micro wankel engine using MEMS technology 显示文摘	Lee C H Jiang K C Jin P	2004	Microelectronic Engineering2004，，：	1
5	Nanofabrication using hot embossing lithography and electroforming显示文摘	Schift H	2001	Microelectronic Engineering2001，，5758：	1
6	Fabrication and Characterization of Single Electron Transistor on SOI显示文摘	Wang Q Chen Y F Long S B	2007	Microelectronic Engineering2007，84，58：	1
7	Nanoscale patterning using photo-assisted polymer transfer lithography 显示文摘	PARK I S JANG M JINHO A	2007	Microelectronic Engineering2007，84，5678：	1
8	Influence of the Pt electrode on the properties of sol-gel PZT-films显示文摘	Willems G J Wouters D J Maes H E	1995	Microelectronic Engineering1995，29，14：	1
9	Completely (001)-textured growth and electrical properties of Bi4Ti3O12/LaNiO3 heterostructures prepared by pulsed laser deposition on LaAlO3 single crystal substrates显示文摘	ZHANG X J ZHANG S T CHE Y F	2003	Microelectronic Engineering2003，66，：	1
10	Influence of Process Parameter on Chemical Mechanical Polishing of Copper显示文摘	Z Stavreva D Zeidler M Plotner	1997	Microelectronic Engineering1997，3738，：	1
11	Influence of process parameters on chemical-mechanical polishing of copper 显示文摘	STAVREZA Z ZIDLER D PLOTNER M	1997	Microelectronic Engineering1997，37，38：	1
12	Top down fabrication of long silicon nanowire de- vices by means of lateral oxidation 显示文摘	Giovanni Pennelli	2009	Microelectronic Engineering2009，86，：	1
13	Chemicalmodification of carbon nanotube for improvement of fieldemission property 显示文摘	Sunwoo Lee Tetsuji Oda Paik-Kyun Shin	2009	Microelectronic Engineering2009，86，：	1
14	30 years of electroless plating for semiconductor and polymer micro-systems 显示文摘	SHACHAM-DIAMAND Y OSAKA T OKINAKA Y	2015	Microelectronic Engineering2015，132，：	1
15	Microcontacts with Sub-30 tan Pitch for 3D Chip-on-chip Integration显示文摘	Huebner H Penka S Barchmann B	2006	Microelectronic Engineering2006，83，1112：	1
16	Flow behaviour of thin polymer films used for hot embossing lithography显示文摘	HEYDERMAN L J SCHIFT H DAVID C	2000	Microelectronic Engineering2000，54，：	1
17	The digital micromirror device for projection display显示文摘	Gale Richard O	1995	Microelectronic Engineering1995，27，：	1
18	Removal of Etching/Ashing Residues and Ashing/Wet-clean Damage in Porons Silica Low-k Films显示文摘	Yamanishi T Ono T Kohmura K	2006	Microelectronic Engineering2006，83，1112：	1
19	Controlled assembly of single SWNTs bundle using dielectrophoresis显示文摘	Seo Hee-Won Han Chang-Soo Choi Dae-Geun	2005	Microelectronic Engineering2005，81，1：	1
20	22 nm silicon nanowire gas sensor fabricated by trilayer nanoimprint and wet etching显示文摘	GAO Chen DENG Shaoren WAN Jing	2010	Microelectronic Engineering2010，87，：	1

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