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50篇 您的检索式：期刊名="J Microelectromechan Systems"

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	题名	作者	年代	出处	被引量
1	A simple fabrication process for polysilicon side-drive micromotors显示文摘	Deng K Mehregany M Dewa A S	1994	J Microelectromechanic Systems1994，3，4：	1
2	The indent reflow sealing(IRS) technique-A method for the Fabrication of sealed cavities for MEMS devices 显示文摘	Harrie A C Tilmans Myriam D J Van de Peer Eric Beyne	2000	J Microelectromechan Systems2000，9，2：	1
3	High aspect-ratio combined poly and single-crystal silicon(HARPSS)MEMS technology显示文摘	AYAZI F NAJAFI K	2000	J Microelectromechanical Systems2000，9，3：	1
4	Electrostatic micromeehanical actuator with extended range of travel 显示文摘	CHAN E K DUTTON R W	2000	J of Microelectromechanical Systems2000，9，3：	1
5	M-TEST:a test chip for MEMS material property measurement using electrostatically actuated test structures显示文摘	Peter M Osterberg Stephen D Senturia	1997	J Microelectromechanical Systems1997，6，2：	1
6	Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging显示文摘	CHENG Y T LIN L NAJAFI K	2000	J Microelectromechanical Systems2000，9，1：	1
7	Reduced-order modeling of weakly nonlinear MEMS devices with Taylor-series expansion and Arnoldi approach显示文摘	Chen J H Kang S M Zou J	2004	J of Microelectromechanical Systems2004，13，3：	1
8	Extending the travel range of analog-tuned electrostatic actuators显示文摘	HUNG E S SENTURIA S D	1999	J Microelectromechanical Systems1999，8，4：	1
9	Resonant silicon pressure sensors in bulk micromachining technology-an approach 显示文摘	BURRER C ESTEVE J TAMAYO E L	1996	J Microelectromechanical Systems1996，5，2：	1
10	Dynamic Pull-in of Parallel-plate and Torsional Electrostatic MEMS Actuators显示文摘	Gregory N N George B	2006	J of Microelectromechanical Systems2006，，15：	1
11	Mechanical properties evalution and failure analysis of cantilevered LIGA nickel microposts显示文摘	Stephens L S Kelly K W Simhadri S	2001	J Microelectromechanical Systems2001，10，3：	1
12	Microstructure to substrate self-assembly using capillaryforces显示文摘	SRINIVASAN U HOWE R T LIEPMANN D	2001	ASME/IEEE J of Microelectromechanical Systems2001，10，1：	1
13	A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators显示文摘	Ziaie B Jeffrey A Von A	1996	J of microelectromechanical system1996，5，3：	1
14	A methodology and model for the pull-in parameters of electrostatic actuators显示文摘	Bochobza-Degani Ofir	2001	J Microelectromechanical Systems2001，10，6：	1
15	A microreactor for hydrogen production in micro fuel cell applications 显示文摘	Pattekar A V Kothare M V	2004	J Microelectromechanical Systems2004，13，1：	1
16	Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array显示文摘	Schaufelbuhl A Schneeberger N Munch U	2001	J Microelectromechanical Systems2001，10，4：	1
17	Microfabricated Lamb wave device based on PZT Sol-Gel thin film for mechanical transport of solid particles and liquids 显示文摘	LUGINBUHL P H COLLINS S D RACINE G A	1997	J Microelectromechanical Systems1997，6，：	1
18	Magnetic microactuator of polysilicon flexure structures 显示文摘	JUDY J W MULLER R S	1995	IEEE J of Microelectromechanical Systems1995，4，4：	1
19	Magnetic microactuators based on polymer magnets 显示文摘	LAGURE L K BRAND O	1999	IEEE J of Microelectromechanical Systems1999，8，1：	1
20	A Methodology and Model for the Pull-In Parameters of Magneto-Static Actuators显示文摘	Nemirovsky Y Zelniker I Degani O Sarusi G	2005	J Microelectromechanical Systems2005，14，6：	1

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