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31篇 您的检索式：期刊名="IRPS"

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	题名	作者	年代	出处	被引量
1	Towards Virtual Engineering in Machine Tools Design 显示文摘	G Bianchi F Paolucci P Vanden Braembussche	1996	C IRP Annals-manufacturing Technology1996，45，1：	1
2	Themlal issues in machine tools 显示文摘	Mayr J Jedrzejewski J Uhlmann E	2012	C IRP Annals-M anufacturing Technology2012，61，2：	1
3	Comparison of ESD Protection Capability of SO1 and BULK CMOS output Buffers 显示文摘	Mansun Chan Selina S Yuen ZhiJian Ma	1994	IEEE/IRPS1994，，：	1
4	World Cases of Occupational HIV Infection显示文摘	Jane Perry	1999	IRPS1999，4，4：	1
5	Sheet drawing through a wedge-shaped die显示文摘	Masuda M Murota T Jimma T	1965	Annals IRP1965，13，：	1
6	Source-sink relationships in crop plants显示文摘	Venkateswarlu B Viperas R M	1987	IRPS1987，125，：	1
7	Realizing energy reduction of machine tools through a controlintegrated consumption graph - based optimization method 显示文摘	Eberspaechera P Verta A	2013	Procedia C IRP2013，，7：	1
8	Pneumatic bulging of magnesium AZ 31 sheet metals at elevated temperatures 显示文摘	SIEGERT K J AGER S VULCAN M	2003	C IRP Annals-Manufacturing Technology2003，52，1：	1
9	Source-sink relationships in crop plants: a review 显示文摘	VENKATESWARLU B VISPERAS R M	1987	IRPS1987，125，：	1
10	The chemistry of failure analysis 显示文摘	JACQUES M	1979	IRPS1979，17，：	1
11	Severe plastic deformation (SPD) processes for metals 显示文摘	Azushima A Kopp R Korhonen A	2008	C irp Annals-Manufacturing Technology2008，57，2：	1
12	Source-sink relationships in crop plants: a review显示文摘	Venkateswarlu B Visperas R M	1987	IRPS1987，，2：	1
13	Incorporating lifecycle considerationsin axiomatic design显示文摘	Stiassnie E Shpitalni M	2007	IRP Annals-Manufacturing Technology2007，56，1：	1
14	Measurement of silicon strength as affected by wafer back processing 显示文摘	Hawkins G Berg H Mahalingam M	1987	IEEE IRPS1987，2388，7：	1
15	Toolholder/Spindle Inter- faces for CNC Machine Tools显示文摘	Agapiou J Rivin E Xie C	1995	Annals of IRP1995，41，1：	1
16	Source-sink relationships in crop plants: A review显示文摘	Venkateswarlu B Visperas R M	1987	IRPS1987，，：	1
17	Neutroninduced latch up in SRAMs at ground level 显示文摘	DODD P E SHANEYFELT M R SCHWANK J R	2003	The 41^st Int Reliability Physics Symp(IRPS)2003，，：	1
18	Measure- ment of silicon strength as affected by wafer back process- ing 显示文摘	HAWKINS G BERG H MAHALINGAM M	1987	IEEE IRPS1987，2388，7：	1
19	Maintenance data manage- ment system显示文摘	Shozo Takata Yuu Inoue	1999	Annals of the C IRP1999，48，1：	1
20	Electrostatic discharge failures of semiconductor devices显示文摘	Unger B A	1981	IEEE/PROC IRPS1981，，：	1

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