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	题名	作者	年代	出处	被引量
1	Micromechatronics and the miniaturization of structures, devices, and systems, Components, Packaging, and Manufacturing Technology(Part C)显示文摘	Friedrich CR Fang J Warrington RO	1997	IEEE Transactions on Components Hybrids and Manufacturing Technology1997，20，：	2
2	Electrical conduction models for isotropically conductive adhesive joints显示文摘	MORRIS J E	1997	IEEE Transactions on Components Package Manufacturing Technology1997，20，1：	1
3	Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder Interface显示文摘	XU L H PANG J H L PRAKASH K H	2005	IEEE Transactions on Components and Packaging Technology2005，28，3：	1
4	Criteria for the Assessment of Reliability Models显示文摘	MICHAEL G P ANAND A S	1997	IEEE Transaction on Components1997，20，3：	1
5	Multi-Objective placement of electronic components using evolutionary algorithms显示文摘	DEB K JAIN P GUPTA N	2004	IEEE Transactions on Components and Packaging Technologies2004，27，3：	1
6	Silver-metal Oxides an Contact Materi- als显示文摘	Karl-Heinz Schroder	1987	IEEE Transactions on components Hybrids and Man- ufacturing Technology1987，10，1：	1
7	Thermal simulation of switchgear显示文摘	Paulke J Weichert H Steinhaeuser P	2002	IEEE Transactions on Components and Packaging Technologies2002，25，3：	1
8	Mechanism of electrical con- duction though anisotropically conductive adhesive films 显示文摘	Mizuno M Saka M Abe H	1996	IEEE Transactions on Components Packaging and Manufacturing Technology Part A1996，19，4：	1
9	Effect of the inlet location on the performance of parallel-channel cold-plate 显示文摘	High-performance heat Device Letters IEEE LU M C WANG C C	2006	IEEE Transactions on Components and Packaging Techno\|ogies2006，29，1：	1
10	Effects of Cu/Al intermetallic compound on copper wire and aluminum pad bondability显示文摘	Kim H J Lee J Y Paik K W	2003	IEEE Transactions on Components and Packaging Technology2003，26，2：	1
11	Influence of microstructure on dielectric strength of Cu-Cr contact materials in vacuum显示文摘	Ding B J Yang Z Wang X	1996	IEEE Transactions on Components Packaging and Manufacturing Technology A1996，19，10：	1
12	The Effect of Material Transfer in Relays Diagnosed by Force and/or Voltage Measurement显示文摘	NEUHAUS A R RIEDER W F	2004	IEEE Transactions on Components and Packaging Technologies2004，27，1：	1
13	Transition from the Anodic Arc Phase to the Cathodic Metallic Arc Phase in Vacuum at Low DC Electrical LeveI显示文摘	Ben Jemma N Morin L	2002	IEEE Transactions on Components Packaging Technologies2002，25，4：	1
14	A nonspurious 3D vector discontinuous Galerkin finite-element time- domain method显示文摘	Fu Chen Liu Qinghuo Chai Mei	2010	IEEE Transactions on microwave and Wireless Components Letters2010，20，1：	1
15	A costbenefit Analysis model of product design for recyclability and its application 显示文摘	Chen Rosy Wei Dundee Navin Chandra Prinz Fritz B	1994	IEEE Transactions on Components Packaging and Manufacturing Technology--Part A1994，14，4：	1
16	Heat transfer analysis and simplified termal resistance modeling of linear motor driven stages for SMT applications显示文摘	Jang Changsoo Kim Jong Young Kim Yung Joon	2003	IEEE Transactions on Components and Packaging Technologies2003，26，3：	1
17	Process-based cost modeling显示文摘	BLOCH C RANGANATHAN R	1992	IEEE Transaction on Components Hybrids and Manufacturing Technology1992，15，3：	1
18	Effect of Surface Roughness on Paper Substrate Circuit Board显示文摘	Ryan A and Lewis H	2012	IEEE Transactions on Components Packaging and Manufacturing Technology2012，2，7：	1
19	Comparison of Micro-PinFin and Micro-channel Heat Sinks Considering Thermal-Hydraulic Performanceand Manufacturability显示文摘	Benjamin A J Yongho J Kevin T	2010	IEEE Transactions on Components and Packaging Technology2010，33，1：	1
20	Capacitive pressure sensor with very large dynamic range 显示文摘	Bakhoum E G Cheng M H M	2010	IEEE Transactions on Components and Packaging Technology2010，33，1：	1

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