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42篇 您的检索式：期刊名="IEEE Trans On Advanced Packaging"

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	题名	作者	年代	出处	被引量
1	Passivity Check of S-Parameter Descriptor Systems Via S-Parameter Generalized Hamiltonian Methods显示文摘	Zhang Z Lei C U Wong N	2010	IEEE Trans on Advanced Packaging2010，33，4：	1
2	Analysis and ap- plication of 3-D LTCC directional filter design for multiband millimeter-wave integrated module 显示文摘	Sarkar S Pinel S Kidera N	2007	IEEE Trans on Advanced Packaging2007，30，1：	1
3	Waterjet-guided laser teclmology:a damage-free dicing solution 显示文摘	PERROTTET D DURRANT P RICHERZHAGEN B	2006	IEEE Trans on Advanced Packaging2006，29，6：	1
4	Efficient computation of interconnect capacitances using the domain decomposition approach显示文摘	Veremey V V Mittra R	1999	IEEE Trans on Advanced Packaging1999，22，3：	1
5	Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packages显示文摘	KUANG J H SHEEN M T CHANG C F H	2001	IEEE Trans on Advanced Package2001，24，4：	1
6	Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via ) and their flip-chip microbumps显示文摘	SELVANAYAGAM C S LAU J H ZHANG X W	2009	IEEE Trans on Advanced Packaging2009，32，4：	1
7	Multiplechip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps显示文摘	SASAKI J ITOH M TAMANUKI T	2001	IEEE Trans on Advanced Packaging2001，24，4：	1
8	Water Jet Guided Laser Technology: A Damage Free Dicing Solution 显示文摘	Perrottet D Durrant P Richerzhagen B	2006	Ieee Trans On Advanced Packaging2006，29，12：	1
9	Analysis and Application of 3-D LTCC directional filter design for muhiband millimeter-wave integrated module 显示文摘	Sarkar S Pinel S Kidera N	2007	IEEE Trans on Advanced Packaging2007，30，1：	1
10	A compact LTCC-based ku-band transmitter module显示文摘	Chang-Ho Lee Albert Sutono Sangwoo Han	2002	IEEE Trans on Advanced Packaging2002，25，3：	1
11	Power Distribution Networks for System-on-Package:Status and Challenges显示文摘	Swaminathan M Kim J Novak I	2004	IEEE Trans on advanced Packaging2004，27，2：	1
12	A new discrete transmission line model for passive model order reduction and macromodding of high speed interconnections 显示文摘	Cangellaris A C Pasha S Prince J L	1999	IEEE Trans on Advanced Packaging1999，22，3：	1
13	Multiple emitter location and signal parameter estimation 显示文摘	SCHMIDT R O	1986	IEEE Trans on Advanced Packaging1986，34，3：	1
14	Heat transfer in multiple air jet impingement using pin-fin heat sinks 显示文摘	El-Sheikh H A Garimella S V	2000	IEEE Trans on Advanced Packaging2000，23，：	1
15	Wirebonding process monitoring using thermopile temperature sensor显示文摘	SUMAN S GAITAN M YOGENDRA J	2005	IEEE Trans on Advanced Packaging2005，28，4：	1
16	Efficient computation of interconnect capacitances using the domain decomposition approach 显示文摘	Veremey V V Mittra R	1999	IEEE Trans On Advanced Packaging1999，22，3：	1
17	Stability, Causality, and Passivity in Electrical interconnect models显示文摘	Triverio P Grivet-Talocia S Nakhla M	2007	IEEE Trans on Advanced Packaging2007，3，4：	1
18	Computer Code for Passivity Enforcement of Rational Macromodels by Residue Perturbation显示文摘	Gustavsen B	2007	IEEE Trans on Advanced Packaging2007，23，4：	1
19	Packaging for microelectromechanical and nanoelectromechanical systems显示文摘	LEE Y C PARVIZ B A CHIOU A	2003	IEEE Trans on Advanced Packaging2003，26，3：	1
20	An Adaptive Sampling Technique for Passivity Characterization and Enforcement of Large Interconnect Macromodels显示文摘	Grivet-Talocia S	2007	IEEE Trans on Advanced Packaging2007，30，2：	1

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