维普期刊资源整合服务平台（V6.5）

284篇 您的检索式：期刊名="IEEE Trans Comp"

选中清除导出查看参考文献查看引证文献引用追踪共15页首页上一页第1页下一页末页 /15 跳转

	题名	作者	年代	出处	被引量
1	Contact Materials Performances Under Break Arc in Automotive Applications显示文摘	Jemma N B Jaennot D	2000	IEEE Trans Comp2000，23，2：	1
2	Electrical conduction models for isotropically conductive adhesive joints显示文摘	Li Li James E Morris	1997	IEEE Trans Comp Packg Manuf Technol1997，，：	1
3	On a class of multistage interconnection networks显示文摘	C L Wu T Y Feng	1980	IEEE Trans Comp1980，29，：	1
4	Testing schemes for FIR filter structures 显示文摘	MUKHERJEE N RAJSKI J TYSZER J	2001	IEEE Trans Comp2001，50，7：	1
5	Methodology for Thermal Evaluation of Multichip Modules 显示文摘	Lall Balwant S Guenin Bruce M Molnar Ronald J	1995	IEEE Trans Comp Packg Manufa Technol Part A1995，18，4：	1
6	An interpolated flux scheme for cellular automata device simulation显示文摘	Fukuda K Nishi K	1998	IEEE Trans Comp Aid Des of Integr Circ and Syst1998，17，7：	1
7	显示文摘	Stephane C Thomas R Martine L B	2007	IEEE Trans Comp and Pack Tech2007，30，：	1
8	Arithmetic additive generators of pseudo-exhaustive test patterns 显示文摘	GUPTA S RAJSKI J TYSZER J	1996	IEEE Trans Comp1996，45，8：	1
9	Energy- and performance- aware mapping for regular NoC architectures 显示文摘	HU J MARCULESCU R	2005	IEEE Trans Comp Aid Des Integr Circ : Syst2005，24，4：	1
10	An efficient test vector compression scheme using selective Huffman coding 显示文摘	JAS A GHOSH-DASTIDAR J TOUBA N A	2003	IEEE Trans Comp Aid Des2003，22，6：	1
11	Integrated LFSR reseeding, test access optimization, and test scheduling for core-based system-on-chip 显示文摘	ZHANGLEI W CHAKRABARTY K SEONGMOON W	2009	IEEE Trans Comp Aid Des Integr Circ Syst2009，28，8：	1
12	Feasibility of an integrated self biased coplanar isolator with barium ferrite films 显示文摘	Capraro S Rouiller T Le Berre M	2007	IEEE Trans Comp Pack Techno2007，30，：	1
13	VLASIC: a catastrophic fault yield simulator for integrated circuits 显示文摘	WALKER H DIRECTOR S W	1986	IEEE Trans Comp Aid Des Integr Circ and Syst1986，5，4：	1
14	Simulation of the gasdynamic and electromagnetic processes in low voltage switching arcs 显示文摘	KARETrA F LINDMAYER M	1998	IEEE Trans Comp Trans Packa Manufact Technol Part A1998，21，1：	1
15	Investigation on the switching behavior of AgSnO2 material in commercial contactors 显示文摘	Mayer U Michal R	1985	IEEE Trans Comp1985，8，1：	1
16	System-on-a- chip test data compression and decompression architectures based on Golomb codes显示文摘	CHANDRA A CHAKRABARTY K	2001	IEEE Trans Comp Aid Des2001，20，3：	1
17	The Net Zero Mass Loss Phenomenon on Opening Switching Contacts with AC Loading 显示文摘	McBride J W	1999	IEEE Trans Comp Package Manufacture Technology1999，22，1：	1
18	Comparison of the inherent erosion behaviors of silver-cadmium oxide and silver-tin oxide contact materials显示文摘	Leung C H	1987	IEEE Trans Comp1987，10，1：	1
19	Built-in test for circuits with scan based on reseeding of multiple-polynomial linear feedback shift registers显示文摘	Hellebrand S Rajski J Tarnick S	1995	IEEE Trans on Comp1995，44，2：	1
20	Silver- metal oxide as contact materials显示文摘		1987	IEEE Trans Comp1987，10，1：	1

返回顶部每页显示：

共15页首页上一页第1页下一页末页 /15 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示