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57篇 您的检索式：期刊名="IEEE Trans Advanced Packag"

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	题名	作者	年代	出处	被引量
1	Frequency-dependent crosstalk simulation for on-chip interconnections 显示文摘	Deutsch A Smith H H	1999	IEEE Trans Advanced Packaging1999，22，3：	1
2	Passivity Check of S-Parameter Descriptor Systems Via S-Parameter Generalized Hamiltonian Methods显示文摘	Zhang Z Lei C U Wong N	2010	IEEE Trans on Advanced Packaging2010，33，4：	1
3	Analysis and ap- plication of 3-D LTCC directional filter design for multiband millimeter-wave integrated module 显示文摘	Sarkar S Pinel S Kidera N	2007	IEEE Trans on Advanced Packaging2007，30，1：	1
4	Advanced modeling and accurate characterization of a 16 Gb/s memory interface 显示文摘	BEYENE W T MADDEN C CHUN J H	2009	IEEE Trans Advanced Packaging2009，32，3：	1
5	Waterjet-guided laser teclmology:a damage-free dicing solution 显示文摘	PERROTTET D DURRANT P RICHERZHAGEN B	2006	IEEE Trans on Advanced Packaging2006，29，6：	1
6	Efficient computation of interconnect capacitances using the domain decomposition approach显示文摘	Veremey V V Mittra R	1999	IEEE Trans on Advanced Packaging1999，22，3：	1
7	Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packages显示文摘	KUANG J H SHEEN M T CHANG C F H	2001	IEEE Trans on Advanced Package2001，24，4：	1
8	Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via ) and their flip-chip microbumps显示文摘	SELVANAYAGAM C S LAU J H ZHANG X W	2009	IEEE Trans on Advanced Packaging2009，32，4：	1
9	Multiplechip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps显示文摘	SASAKI J ITOH M TAMANUKI T	2001	IEEE Trans on Advanced Packaging2001，24，4：	1
10	Thermal Cycling Lifetime of Flip Chip on Board Circuits with Solder Bumps and Isotropically Conductive Adhesive Joints显示文摘	Nysaether J B Lai Z Liu J	2000	IEEE Trans Advanced Packaging2000，23，4：	1
11	Water Jet Guided Laser Technology: A Damage Free Dicing Solution 显示文摘	Perrottet D Durrant P Richerzhagen B	2006	Ieee Trans On Advanced Packaging2006，29，12：	1
12	Analysis and Application of 3-D LTCC directional filter design for muhiband millimeter-wave integrated module 显示文摘	Sarkar S Pinel S Kidera N	2007	IEEE Trans on Advanced Packaging2007，30，1：	1
13	A compact LTCC-based ku-band transmitter module显示文摘	Chang-Ho Lee Albert Sutono Sangwoo Han	2002	IEEE Trans on Advanced Packaging2002，25，3：	1
14	Impedance and crosstalk of stripline and microstrip transmission lines显示文摘		1997	IEEE Trans Advanced Packaging1997，20，3：	1
15	Power Distribution Networks for System-on-Package:Status and Challenges显示文摘	Swaminathan M Kim J Novak I	2004	IEEE Trans on advanced Packaging2004，27，2：	1
16	A microjet array cooling system for thermal management of high- brightness LEDs 显示文摘	LUO X B CHEN W SUN R X	2007	IEEE Trans Advanced Packag2007，30，3：	1
17	MEMS post-packaging by localized heating and bond- ing显示文摘	Lin L	2000	IEEE Trans Advanced Packaging2000，23，4：	1
18	A new discrete transmission line model for passive model order reduction and macromodding of high speed interconnections 显示文摘	Cangellaris A C Pasha S Prince J L	1999	IEEE Trans on Advanced Packaging1999，22，3：	1
19	Multiple emitter location and signal parameter estimation 显示文摘	SCHMIDT R O	1986	IEEE Trans on Advanced Packaging1986，34，3：	1
20	Heat transfer in multiple air jet impingement using pin-fin heat sinks 显示文摘	El-Sheikh H A Garimella S V	2000	IEEE Trans on Advanced Packaging2000，23，：	1

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