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26篇 您的检索式：期刊名="CircuiTree"

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	题名	作者	年代	出处	被引量
1	Laser Developments Expand LDI Capabilities显示文摘	Sri Venkat	2005	Circuitree2005，，9：	1
2	Injet technology comes of age显示文摘	Schucht D	2006	Circuitree2006，6，：	1
3	Tin whisker growth: Substrate effect understanding CTE mismatch and IMC formation显示文摘	ZHANG Y FAN C XU C KHASELEY O ABYS J	2004	CircuiTree2004，17，6：	1
4	Understanding whisker phenomenon:The driving force for whisker formation显示文摘	ZHANG Y FAN C	2002	Circuitree2002，15，5：	1
5	Signal integrity consoderations in high-reliability designs显示文摘	Tarun Amla and Sean Mirshafiei	2007	Circuitree2007，3，：	1
6	How to Design with Flex in Mind显示文摘	Mark Finstad	2006	Circuitree2006，，1：	1
7	The use of a chemical fixing agent with colloidal graphite for producing high reliability through vias and microvias 显示文摘	CARANO M POLAKOVIC F EDWIN THORN C	1999	CircuiTree1999，12，：	1
8	Plated through-hole voiding-root causes and corrective actions显示文摘	Michael Carano	2008	Circuitree2008，2，：	1
9	Evolution of a Wiring Concept:30 Years of Flex-Rigid Circuit Board Production显示文摘	Lars Martin	2006	Circuitree2006，11，：	1
10	Evolution of a wiring concept:30 years of flex-rigid circuit board production 显示文摘	Lars Martin	2006	Circuitree2006，11，：	1
11	ENEPIG: A final finsh that' s time has come 显示文摘	George Milad	2010	Circuitree2010，，5：	1
12	Improved organic solderabolity preservative for mixed metal finishes显示文摘	Michael Carano and Koji Saeki	2004	Circuitree2004，，5：	1
13	New final finish candidate for IC package 显示文摘	Dennis K W Yee	2007	Circuitree2007，，1：	1
14	New Capability for HDI Microvia Defect Detection显示文摘	Mark Swart Dave Wilkie	2009	Circuitree January 12009，2009，：	1
15	HDI Production Using Pulse Plating with Insoluble Anodes显示文摘	Stephen Kenny and Kai Matejat	2001	circuitree2001，2001，：	1
16	Borland and Saul Ferguson, EmbeddedPassive Components in Printed Wiring Boards: A Technology Review显示文摘	William J	2001	Circuitree2001，10，：	1
17	ENEPIG:A final finsh that's time has come 显示文摘	George Milad	2010	Circuitree2010，，5：	1
18	Flexible PCBs and plating through holes, challenges and solutions显示文摘	Nell Patton	2005	Circuitree2005，，9：	1
19	Improved organic solderabolity preservative for mixed metal finishes显示文摘	Michael Carano and Koji Saeki	2004	Circuitree2004，，5：	1
20	O' Flaherty, Optical reflectivity as a nondestructivive measurement technique for OSP coating thickness on production PCBs显示文摘	Sean M	2008	Circuitree2008，3，：	1

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