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| 1 | Simulation Analysis and Verifcation of Temperature and Stress of Wheel-Mounted Brake Disc of a High-Speed Train显示文摘During the braking process,a large amount of heat energy is generated at the friction surfaces between the brake disc and pads and rapidly dissipates into the disc volume.In this paper,a three-dimensional thermo-mechanical coupling model of high-speed wheel-mounted brake discs containing bolted joints and contact relationships is established.The direct coupling method is used to analyze the temperature and stress of the brake discs during an emergency braking event with an initial speed of 300 km/h.A full-scale bench test is also conducted to monitor the temperatures of the friction ring and bolted joints.The simulation result shows that the surface temperature of the friction ring reaches its peak value of 414°C after 102 s of braking,which agrees well with the bench test result.The maximum alternating thermal stress occurs in the bolt hole where the maximum circumferential compressive stress is−658 MPa and the maximum circumferential tensile stress is 134 MPa.During the braking process,the out-of-plane deformation of the middle part of the friction ring is larger than that of the edge,which increases the axial tensile load of the connecting bolt.This work provides support for the design of brake discs and connecting bolts. | Junsheng Qu Wenjing Wang Ziyu Dong Wei Shan | 2022 | Chinese Journal of Mechanical Engineering2022，35，4： | 0 |
| 2 | Editorial: Thermal Stresses显示文摘Thermomechanical properties of materials have significant influences on the normal operation and service life of devices and structures.It is therefore of crucial importance to analyze their thermomechanical responses in numerous application areas such as mechanical engineering,civil engineering,electronic technology,and machine manufacturing.Demands on thermomechanical analyses or thermal stress analysis of materials and structures subject to various thermal loads are growing with the expanding of novel materials(e.g.,graphene,phononic crystals),new technologies(e.g.,three-dimensional printing,transfer printing),and new devices(e.g.,flexible electronics,stretchable electronics).In the last few decades,thermal stress analyses have attracted much attention from academia and industry with not only Journal of Thermal Stresses for publishing novel and cutting edge researches,but also series of International Congress on Thermal Stresses to exchange ideas and extend further collaborations for scientists and engineers who are involved in the field of thermal stresses. | Jizhou Song Weiqiu Chen | 2019 | Theoretical & Applied Mechanics Letters2019，9，5： | 0 |
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