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| 1 | Microstructure-based multiphysics modeling for semiconductor integration and packaging显示文摘Semiconductor technology and packaging is advancing rapidly toward system integration where the packaging is co-designed and co-manufactured along with the wafer fabrication.However,materials issues,in particular the mesoscale microstructure,have to date been excluded from the integrated product design cycle of electronic packaging due to the myriad of materials used and the complex nature of the material phenomena that require a multiphysics approach to describe.In the context of the materials genome initiative,we present an overview of a series of studies that aim to establish the linkages between the material microstructure and its responses by considering the multiple perspectives of the various multiphysics fields.The microstructure was predicted using thermodynamic calculations,sharp interface kinetic models,phase field,and phase field crystal modelingtechniques.Based on the predicted mesoscale microstructure,linear elastic mechanical analyses and electromigration simulations on the ultrafine interconnects were performed.The microstructural index extracted by a method based on singular value decomposition exhibits a monotonous decrease with an increase in the interconnect size.An artificial neural network-based fitting revealed a nonlinear relationship between the microstructure index and the average von Mises stress in the ultrafine interconnects.Future work to address the randomness of microstructure and the resulting scatter in the reliability is discussed in this study. | Zhiheng Huang Hua Xiong Zhiyong Wu Paul Conway Hugh Davies Alan Dinsdale Yunfei En Qingfeng Zeng | 2014 | Chinese Science Bulletin2014，59，15： | 2 |
| 2 | 半导体集成与封装中基于微观组织的多物理场耦合模拟显示文摘半导体技术与封装正向系统集成方向加速发展.在未来的系统集成中,将会同时设计和制造封装与晶片的制备.但是,材料的因素,尤其是微观组织,至今还不在电子封装的集成产品设计平台考虑之列,究其原因是电子封装使用的材料众多而且发生的材料现象复杂.在材料基因组计划(MGI)的背景下,本文综述一系列的研究工作,旨在建立材料微观组织与其在多物理场作用下的响应关系.采用热力学计算、突变界面模型、相场法和晶体相场法的手段来预测微观组织.在预测的微观组织基础上,对超细电子互连进行线弹性力学分析和电迁移仿真.提出采用基于奇异值分解的方法来提取微观组织特征,发现微观组织特征指标随电子互连尺寸的增大而单调递减.基于人工神经网络的拟合揭示了微观组织指标与超细互连中平均von Mises等效应力之间的非线性关系.本文最后展望了考虑微观组织的随机性以及由此而导致的电子互连可靠性上的离散性的研究工作. | 黄智恒 熊桦 伍智勇 CONWAY Paul DAVIES Hugh DINSDALE Alan 恩云飞 曾庆丰 | 2013 | 科学通报2013，58，35： | 0 |
| 3 | Neighborhood topological effect on grain topology-size relationship in three-dimensional polycrystalline microstructures显示文摘A new grain topology-size relationship in three-dimensional(3D)polycrystalline microstructures has recently been established by considering the effects of non-random first nearest neighbor grains.In this contribution,a generalized form for this relationship is presented by considering the interactions of kth(k=1,2,3…)nearest neighbor grains,and large scale Monte Carlo-Potts model simulation is used to investigate the general neighborhood topological effect on the topology-size relationship.The results show that,unlike their first nearest neighbors(k=1),the topological correlations of 3D grains with their kth layers(k 2)of nearest-neighbors may have trivial effect on the topology-size relationship. | ASAD Ullah LIU GuoQuan WANG Hao MATIULLAH Khan DIL Faraz Khan M ZUBAIR Iqbal | 2013 | Chinese Science Bulletin2013，58，30： | 0 |
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