共被期刊论文引用了3次
您的检索式：您选中1篇文献正在查看引证文献汇总
|
|
|
题名
|
作者
|
年代
|
出处
|
被引量
|
| 1 | DECAY RATE OF SAINT-VENANT END EFFECTS FOR PLANE DEFORMATIONS OF PIEZOELECTRIC-PIEZOMAGNETIC SANDWICH STRUCTURES显示文摘This paper is concerned with the decay of Saint-Venant end effects for plane deformations of piezoelectric(PE)-piezomagnetic(PM) sandwich structures,where a PM layer is located between two PE layers with the same material properties or reversely.The end of the sandwich structure is subjected to a set of self-equilibrated magneto-electro-elastic loads.The upper and lower surfaces of the sandwich structure are mechanically free,electrically open or shorted as well as magnetically open or shorted.Firstly the constitutive equations of PE materials and PM materials for plane strain are given and normalized.Secondly,the simplified state space approach is employed to arrange the constitutive equations into differential equations in a matrix form.Finally,by using the transfer matrix method,the characteristic equations for eigenvalues or decay rates are derived.Based on the obtained characteristic equations,the decay rates for the PE-PM-PE and PM-PE-PM sandwich structures are calculated.The influences of the electromagnetic boundary conditions,material properties of PE layers and volume fraction on the decay rates are discussed in detail. | Yan Xue Jinxi Liu | 2010 | Acta Mechanica Solida Sinica2010，23，5： | 2 |
| 2 | 反平面剪切状态下压电-压磁夹层结构的圣维南端部效应显示文摘研究了反平面状态下压电-压磁夹层结构的圣维南端部效应的衰减特征.夹层结构端部的力-电-磁载荷是自平衡的;外层的边界是应力自由的,但承受四种不同的电磁边界条件,即电学短路/磁学短路、电学短路/磁学开路、电学开路/磁学开路和电学开路/磁学短路.基于磁电弹全耦合的控制方程,推导了问题的精确解和关于衰减率的特征方程.利用得到的特征方程,计算了压电-压磁-压电和压磁-压电-压磁两种夹层结构的衰减率,结果表明电磁边界条件、压电层的材料性能和体积分数对衰减特征有显著的影响.作为特例,分析了压电-弹性-压电夹层结构的衰减特征. | 薛雁 刘金喜 | 2010 | 固体力学学报2010，31，4： | 0 |
| 3 | 电磁复合材料中圆弧形界面导电刚性线尖端应力强度研究显示文摘研究无穷远处反平面力载荷和平面电磁载荷作用下,电磁智能材料中圆弧形界面导电刚性线尖端应力强度问题。运用复变函数方法,得到该问题的一般解;并得到界面上只有一条刚性线时的封闭形式解,求解基体及夹杂区域复势函数、刚性线尖端的应力、电位移和磁感应强度因子。对于压电基体和压磁夹杂情况下,详细讨论刚性线长度以及无穷远处载荷对刚性线尖端应力强度因子的影响规律。当同时加载力电磁载荷时,刚性线尖端的应力、电位移和磁感应强度因子依赖于复合材料的有效材料常数。 | 贺新柱 冯慧 曾鑫 刘又文 | 2013 | 机械强度2013，35，3： | 0 |
您所在的机构暂未开通此部分的功能，请联系管理员