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| 1 | 喷射成形铝硅合金电子封装梯度材料的研究进展显示文摘高硅铝合金电子封装材料以其良好的热物理性能与力学性能,越来越受到材料和电子封装行业研究者的重视,但是其焊接性能与机械性能不理想。铝硅合金梯度板材可解决电子封装材料低膨胀与高机械性能的矛盾,其高硅端热膨胀系数低,导热好,适于裸集成电路;低硅端机械性能高,可焊接,便于精加工和封装,是未来武器装备高集成电路封装构件重要的备选材料。针对这类材料的制备问题,提出了双金属一步式喷射成形技术的概念,并对喷射工艺参数进行了初步的探索研究。2个沉积器的间距可以影响复合板材的外形轮廓与内部硅成分的梯度分布,模拟结果显示间距大于等于40 mm时,出现台阶而且成分变化有突变。 | 曹福洋 于雷 侯立国 贾延东 李海超 孙剑飞 | 2015 | 精密成形工程2015，7，3： | 3 |
| 2 | Flow field simulation of double layer atomizer显示文摘The influences of parameters,such as delivery tube structure,gas pressure and the distance between the primary atomizer and the secondary atomizer,on gas flow field were investigated by simulation.The effects of primary pressure on gas velocity at the centerline were compared.Water atomizing experiment was carried out to validate gas scatter angle.The results show that the structure of primary atomizer plays an important role in the flow field near the exit of delivery tube.Metal protector with conical surface at the body extends certain length into the gas flow field to generate greater negative pressure near the tip of delivery tube. The application of primary gas can suppress the circulation generated by only using the secondary atomizer. | 赵文军 曹福洋 宁志良 孙剑飞 | 2009 | Transactions of Nonferrous Metals Society of China2009，19，S02： | 1 |
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