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| 1 | Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins显示文摘 | Rimdusit S Ishida H | 2000 | Polymer2000，41，22： | 1 |
| 2 | Performance improvement of polybenzoxazine by alloying with polyimide: effect of preparation method on the properties 显示文摘 | Takeichi T Yong Guo Rimdusit S | 2005 | Polyme r2005，46，13： | 1 |
| 3 | Development of New Class of Elec- tronic Packaging Materials Based on Ternary Systems of Benzoxazine Epoxy and Phenolic Resins 显示文摘 | Ishida H Rimdusit S | 2000 | Polymer2000，41，22： | 1 |
| 4 | Curing kinetics of arylamine-based polyfunctional benzoxazine resins by dynamic differential scanning calorimetry 显示文摘 | Jubsilp C Rimdusit S | 2006 | Thermochimica Acta2006，447，： | 1 |
| 5 | Development of new class of electronic pack- aging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins Original Research Article 显示文摘 | Rimdusit S Ishida H | 2000 | Polymer2000，，41： | 1 |
| 6 | Very high thermal conduc- tivity obtained by boron nitride-filled polybenzoxazine 显示文摘 | ISHIDA H RIMDUSIT S | 1998 | Thermochimica aeta1998，，320： | 1 |
| 7 | Very High Thermal Conductivity Ob- tained by Boron Nitride-filled Polybenzoxazine显示文摘 | ISHIDA H RIMDUSIT S | 1998 | Thermochimi- ca Acta1998，320，： | 1 |
| 8 | Effects of aromatic carboxylic dianhydrides on thermomechanical properties of polybenzoxazine-dianhydride copolymers显示文摘 | JUBSILP C RAMSIRI B RIMDUSIT S | 2012 | Polymer Engineering & Science2012，52，8： | 1 |
| 9 | Curing kinetics of arylamine-based polyfunctional benzoxazine resins by dynamic differential scanning calorimetry显示文摘 | JUBSILP C DAMRONGSAKKUL S TAKEICHI T RIMDUSIT S | 2006 | Thermochimica Acta2006，447，2： | 1 |
| 10 | Very thermal conductivity obtained by boron nitride-filled polybenzaxazine显示文摘 | Ishida H Rimdusit S | 1998 | Thermochimica Acta1998，320，12： | 1 |
| 11 | 显示文摘 | Kasemsiri P Hiziroglu S Rimdusit S | 2011 | Thermochimica Ac ta2011，520，12： | 1 |
| 12 | Performance improvement of polybenzoxa-zine by alloying with polyimide:effect of preparation method on the properties显示文摘 | TAKEICHI T GUO Y RIMDUSIT S | 2005 | Polym2005，46，： | 1 |
| 13 | Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins显示文摘 | RIMDUSIT S ISHIDA H | 2000 | Polymer2000，41，： | 1 |
| 14 | Performance improvement of polybenzoxazine by alloying with poly- imide:Effect of preparation method on the properties显示文摘 | TAKEICHI T GUO YONG RIMDUSIT S | 2005 | Polymer2005，46，13： | 1 |
| 15 | Effectof triphenyl phosphate flame retardant on properties ofarylamine-based polybenzoxazines显示文摘 | Rimdusit S Thamprasom N Suppakarn N | 2013 | Journal of Applied Polymer Science2013，130，2： | 1 |
| 16 | Development of new class of electronic packaging materials based on ternary systems of benzoxazine,epoxy,and phennolic resins显示文摘 | Rimdusit S Ishida H | 2000 | Polymer2000，41，： | 1 |
| 17 | Performance improvement of polybenzoxazine by alloying with polyimide: effect of preparation method on the properties 显示文摘 | Takeichi T Yong Guo Rimdusit S | 2005 | Polymer2005，46，13： | 1 |
| 18 | Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins 显示文摘 | Rimdusit S Ishida H | 2000 | Polymer2000，41，22： | 1 |
| 19 | Very High Thermal ConductivityObtained by Boron Nitride-filled Polybenzoxaine显示文摘 | ISHIDA H RIMDUSIT S | 1998 | Thermoch-imica Acta1998，32，： | 1 |
| 20 | Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins显示文摘 | RIMDUSIT S ISHIDA H | 2000 | Polymer2000，41，22： | 1 |
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