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580篇 您的检索式：期刊名="IEEE Transactions on Semiconductor Manufacturing"

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	题名	作者	年代	出处	被引量
1	An overview of Level Set methods for etching, deposition, and lithography development显示文摘	Sethian J A Adalsteinsson D	1997	IEEE Transactions on Semiconductor Manufacturing1997，10，1：	3
2	On the relationship between yield and cycle time in semiconductor wafer fabrication 显示文摘	WEI L M	1992	IEEE Transactions On Semiconductor Manufacturing1992，，5：	1
3	Scheduling of mask shop e-beam writers 显示文摘	HUNG Y F	1998	IEEE Transactions on Semiconductor Manufacturing1998，11，1：	1
4	Fault detection using the k-nearest neighbor rule for semiconductor manufacturing processes显示文摘	HE Q P WANG J	2007	IEEE Transactions on Semiconductor Manufacturing2007，20，4：	1
5	Trade-offs in cycle time management: hot lots 显示文摘	EHTESHAMI B PETRAKIAN R G SHABE P M	1992	IEEE Transaction on Semiconductor Manufacturing1992，，5：	1
6	Extrusion-spin coating:an efficient and deterministic photoresist coating method in microlithography显示文摘	HAN Sang-jun DERKSEN J CHUN Jung-hoon	2004	IEEE Transactions on Semiconductor Manufacturing2004，17，1：	1
7	Material removal regions in chemical mechanical planarization for submicron integrated circuit fabrication:Coupling effects of slurry chemicals,abrasive size distribution,and wafer-pad contact area显示文摘	Luo J F Doronfeld D A	2003	IEEE Transactions on Semiconductor Manufacturing2003，16，1：	1
8	Testing the robustness of various production control policies in semiconductor manufacturing显示文摘	YAN H S LOU S SETHI S	1996	IEEE Transactions on Semiconductor Manufacturing1996，9，2：	1
9	Scheduling Analysis of Timed- constrained Dual-armed Cluster tools 显示文摘	J-H Kim T-E Lee H-Y Lee D-B Park	2003	IEEE Transactions on Semiconductor Manufacturing (S0894-6507)2003，16，3：	1
10	Wire Bond Loop Profile Development for Fine Pitch-Long Wire Assembly显示文摘	Groover R Shu W K Lee S S	1994	IEEE Transactions on Semiconductor Manufacturing1994，7，3：	1
11	Modeling and simulation of an electronic component manufacturing system using Hybrid Petri Nets显示文摘	Mohamed Allam and Hassane Alla	1998	IEEE Transactions on semiconductor manufacturing1998，，3：	1
12	Large-scale semiconductor process fault detection using a fast pattern recognition-based method显示文摘	HE Q P WANG J	2010	IEEE Transactions on Semiconductor Manufacturing2010，23，2：	1
13	Design,fabrication,and characterization of Ni/4H-SiC (0001) Schottky Diodes array equipped with field plate and floating guard ring edge termination structures显示文摘	Sanjeev K G Nirmal P Chandra S	2012	IEEE Transaction on Semiconductor Manufacturing2012，25，4：	1
14	Metrology and inspection requirements for successful stacking of integrated circuits显示文摘	HALDER S MILLER A van PUYMBROECK J	2014	IEEE Transactions on Semiconductor Manufacturing2014，27，3：	1
15	Characterization and modeling of on-chip spiral inductors for Si RFICs显示文摘	C J Chao S C Wong C H Kao	2002	IEEE Transaction on Semiconductor Manufacturing2002，15，1：	1
16	A Petri Net Method for Schedulability and Scheduling Problems in Single-arm Cluster Tools with Wafer Residency Time Constraints显示文摘	Wu Naiqi Chu Chengbin Chu Feng	2008	IEEE Transactions on Semiconductor Manufacturing2008，21，2：	1
17	A steady-state throughput analysis of cluster tools: dual-blade versus single-blade robots 显示文摘	Venkatesh S Davenport R Foxhoven P	1997	IEEE Transactions on Semiconductor Manufacturing1997，10，4：	1
18	Scheduling of semiconductor test facility via Petri nets and hybrid heuristic search显示文摘	Xiong H H Zhou M C	1998	IEEE Transactions on Semiconductor Manufacturing1998，11，3：	1
19	Single-wafer Cluster Tool Performance: An analysis of the Effects of Redundant Chambers and Revisitations Sequences on Throughput 显示文摘	T L Perkinson R S Gyumsik P K MacLarty	1996	IEEE Transactions on Semiconductor Manufacturing (S0894-6507)1996，9，3：	1
20	An adaptive run-to-run optimizing controller for linear and nonlinear semiconductor processes 显示文摘	CASTILLO E D YEH J Y	1998	IEEE Transactions on Semiconductor Manufacturing1998，11，2：	1

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